·
|
Third
quarter net revenues increased 2.7% sequentially and 10.9% year-over-year
to $2.46 billion excluding NXP Wireless and
Flash Memory Group (FMG)
|
·
|
Gross
margin was 37.2% before NXP Wireless
integration
|
In Million US$ and %
|
Q3 2008
|
Q2 2008
|
Q3 2007 ex FMG
|
|||
Net
Revenues
|
2,455
|
2,391
|
2,213
|
|||
Gross
Profit
|
913
|
880
|
865
|
|||
Gross
Margin
|
37.2%
|
36.8%
|
39.1%
|
|||
Effective
Exchange Rate $/€ (a)
|
1.54
|
1.55
|
1.36
|
In Million US$ and %
|
Q3 2008
|
Q2 2008
|
Q3 2007 ex FMG
|
|||
Net
Revenues
|
2,696
|
2,391
|
2,213
|
|||
Gross Profit (a)
|
1,016
|
880
|
865
|
|||
Gross Margin(a)
|
37.7%
|
36.8%
|
39.1%
|
|||
Effective
Exchange Rate $/€
|
1.54
|
1.55
|
1.36
|
In Million US$ and %
|
Q3 2008
|
Q2 2008
|
Q3 2007
|
|||
Net
Revenues
|
2,696
|
2,391
|
2,565
|
|||
Gross
Profit
|
959
|
880
|
902
|
|||
Gross
Margin
|
35.6%
|
36.8%
|
35.2%
|
·
|
The
purchase accounting for the ST-NXP Wireless JV resulted in a $57 million
inventory step-up charged to Cost of Goods Sold and a $76 million
in-process R&D write-off. In addition, $12 million of recurring
amortization is included in operating
expenses.
|
·
|
A non-cash charge of $344
million related to the Numonyx equity investment including $300 million of
impairment to reflect deteriorated conditions in both the equity market
multiples for comparable companies and the memory industry and $44 million
of equity loss on Numonyx’s Q2 2008 results, mostly
reflecting stand-up and purchase accounting items at
Numonyx.
|
·
|
Other
impairment and restructuring charges of $22 million in operating profit
and other-than-temporary impairment charges on financial assets of $14
million.
|
In US$M except EPS
|
Operating
Income
|
Net
Earnings(a)
|
Diluted
EPS(a)
|
|||
Q3
2008 as reported
|
55
|
$(289)
|
$(0.32)
|
|||
NXP Wireless Purchase
Accounting Adjustments(a)
|
(133)
|
(99)
|
$(0.11)
|
|||
Numonyx Impairment /
Loss(a)
|
0
|
(344)
|
$(0.39)
|
|||
Restructuring, Impairments,
One-time & Other-than-temporary charges(a)
|
(22)
|
(24)
|
$(0.02)
|
|||
Q3 2008 ST Business
Operations(b)
|
$210
|
$178
|
$0.19
|
|||
Margin
(as a % of Sales)
|
7.8%
|
As
% of Net Revenues
|
Q3
2008
|
Q3
2008
|
Market
Segment
|
ST
excluding NXP Wireless
|
ST
including NXP Wireless
|
Automotive
|
15%
|
13%
|
Consumer
|
17%
|
16%
|
Computer
|
17%
|
15%
|
Telecom
|
34%
|
40%
|
Industrial
& Other
|
17%
|
16%
|
·
|
ACCI
(Automotive, Consumer, Computer and Telecom Infrastructure Product
Groups)
|
·
|
IMS
(Industrial & Multisegment Product
Sector)
|
·
|
WPS
(Wireless Product Sector)
|
In
Million US$ and %
|
Q3
2008
|
||
Product
Segment
|
Net
|
%
of Net
|
Operating
|
Revenues
|
Revenues
|
income
(loss)
|
|
ACCI (Auto/Cons./Comp./Telecom
Infra. Product Groups) (a)
|
$1,085
|
40.2%
|
$58
|
IMS
(Industrial and Multisegment Product Sector)
|
901
|
33.4
|
152
|
WPS
(Wireless Product Sector)
|
696
|
25.9
|
22
|
Others (b)
(c)
|
14
|
0.5
|
(177)
|
TOTAL
|
$2,696
|
100%
|
$55
|
Net
Revenues
|
First
Nine Months
|
First
Nine Months
|
Year-over-Year
|
(In Million US$ and %) |
2008
|
2007
|
Growth
|
ST
as reported
|
$7,566
|
$7,258
|
4.2%
|
ST
ex FMG and NXP Wireless
|
$7,026
|
$6,252
|
12.4%
|
In
Million US$ and %
|
First
Nine Months 2008
|
||
Net
|
%
of Net
|
Operating
|
|
Product
Segment
|
Revenues
|
Revenues
|
income
(loss)
|
ACCI (Auto/Cons./Comp./Telecom
Infra. Product Groups) (a)
|
$3,231
|
42.7%
|
$110
|
IMS
(Industrial and Multisegment Product Sector)
|
2,538
|
33.5
|
374
|
WPS
(Wireless Product Sector)
|
1,454
|
19.2
|
12
|
FMG (Flash Memories Group)
(d)
|
299
|
4.0
|
16
|
Others (b)(c)
|
44
|
0.6
|
(571)
|
TOTAL
|
$7,566
|
100%
|
$(59)
|
·
|
On
July 28, 2008, ST and NXP announced the closing of the deal bringing
together key wireless operations of both companies into ST-NXP Wireless, a
deal they announced on April 10, 2008. The joint venture, 80% owned by
ST, started operations on August 2, 2008 and launched as a
solid top-three industry player with a complete wireless product and
technology portfolio and as a leading supplier to major handset
manufacturers who together ship more than 80% of all handsets. ST-NXP
Wireless will be among the few companies with the R&D scale and
expertise to meet customer needs in 2G, 2.5G, 3G, multimedia, connectivity
and all future wireless
technologies.
|
·
|
On
August 20, 2008, ST and Ericsson announced an agreement to merge Ericsson
Mobile Platforms and ST-NXP Wireless into a joint venture. The 50/50 joint
venture would have the industry’s strongest product offering in
semiconductors and platforms for mobile applications and will be an
important supplier to Nokia, Samsung, Sony Ericsson, LG and Sharp. The
fabless joint venture would employ almost 8,000 people with pro-forma 2007
sales of $3.6 billion. ST is expected to exercise its option to buy NXP’s
20 percent of ST-NXP Wireless before the closing of this
transaction.
|
·
|
In
digital consumer, ST announced the sampling of the STi7105 high-definition
(HD) video decoder, with enhancements for higher performance, lower power,
and lower bill-of-materials costs in set-top boxes (STBs) and home media
servers. ST also bolstered its leadership in DVB-S2 digital satellite
broadcast with a new ‘front-end’ STB chipset for digital satellite HDTV
equipment. The use of DVB-S2 by consumer equipment manufacturers is
increasing rapidly in a wide range of applications, including Pay-TV and
free-to-air STBs, integrated digital TVs (iDTVs), PC TV cards and HD
Blu-ray Disc equipment.
|
·
|
Also
in STBs, ST announced that Proview will use the STi7101 HDTV decoder in
its new XPS-1000 set-top box, which employs the SBTVD digital terrestrial
standard, for deployment in Brazil. Additionally, ST started production
for two new IPTV STB designs in France and a new standard-definition
H.264 satellite STB for deployment in
India.
|
·
|
In
consumer audio, ST gained two design wins in Korea for its SoundTerminal
family of high-efficiency power ICs that integrate DSP capabilities for
flat-panel TV applications. The device is the latest in the SoundTerminal
family and integrates standard features along with the industry-first
inclusion of a dual-band dynamic-range compressor for Hi-Fi audio and
thin-TV loudspeaker
protection.
|
·
|
In
communications infrastructure applications, ST gained two design wins for
ASICs that will be used by a world-leading manufacturer in its enterprise
switching products. In computer applications, ST gained an important
design-win for a 65nm SoC for a second-generation enterprise hard disk
drive (HDD) from a major HDD maker. ST also won a socket in the
data-security environment from a leading manufacturer, based on the
Company’s high-security solution for HDDs that meets the FIPS 140-2 level
3 standard. In addition, ST successfully demonstrated at IDF the world’s
first MIPHY (Multi Interface PHY) Physical Layer interface for the new
6Gbit/s Serial ATA (SATA)
technology.
|
·
|
In
automotive powertrain and safety applications, ST gained a design win from
a major Japanese player for an alternator platform. The first application
will be in Europe with other car makers expected to use it in Q4 2008. ST
also made strong gains in low- and mid-end powertrain applications,
supplying smart power ICs and microcontrollers (MCUs) to a major Asian car
maker for 1- and 2-cylinder vehicles for emerging Asian markets, and to a
major European car maker for 4-cylinder vehicles for the Russian
market.
|
·
|
In
car-body applications, ST achieved a very important design win from a key
European tier-one supplier for smart-power products in power management
and external light control. Additionally, ST’s market introduction of
next-generation 8- and 32-bit MCUs has led to numerous design wins in many
countries.
|
·
|
In
car multimedia, ST gained a couple of key design wins for car-radio kits.
For the first, a leading European OEM chose an ST MCU, tuner IC, audio
processor and power amp, for a new after-market radio which has been
chosen by a car maker in China; the second kit was selected by a US maker
and includes audio processor and power amp, tuner IC and CD/MP3 decoder
chip. Additionally, a leading automotive OEM in Europe selected ST’s
STA2500D Bluetooth IC for use in Telematic platforms for two leading car
makers.
|
·
|
In
microcontrollers, ST extended its library of functions supporting vector
control of electric motors using the 32-bit Cortex-M3 based STM32 MCU,
which has already been designed into approximately 40 customer
motor-control applications.
|
·
|
In
non-volatile memory, ST introduced 1MHz two-wire serial EEPROMs in
256-Kbit, 512-Kbit and 1-Mbit densities, allowing data rates up to
2.5-times faster than the I2C
Fast-mode.
|
·
|
In
MEMS motion sensors, ST gained design wins for its three-axis
accelerometers with several mobile phone makers in China and a major Asian
player. The Company also gained significant business from a worldwide
leader in the portable
|
|
MP3
player market and also won a significant contract with another of the
major players in the gaming market — ST already supplies MEMS
accelerometers for the Nintendo Wii. Additionally, ST’s complete free-fall
detection solution, which consists of a 3-axis motion sensor and software,
was chosen to protect user data stored on HDDs in the new ESPRIMO Mobile
family of professional notebooks from Fujitsu Siemens
Computers.
|
·
|
Also
in MEMS, ST launched an ultra-compact gyroscope that provides a choice of
analog or digital absolute angular-rate outputs, and measures fast angular
displacements in applications such as intuitive man-machine interfaces or
enhanced-GPS for car
navigation.
|
·
|
In
power conversion, ST introduced a new Pulse Width Modulation controller,
the first integrated device optimized for soft-switching asymmetrical
half-bridge converters. The company also gained a design win from a major
player in the PC market for two voltage-regulator modules for the CPU
power supply in a desktop reference design; in addition to another design
win for a new powerline communication transceiver with a manufacturer in
China for a sub-metering application. ST is also ramping up production of:
a new power management controller, for a major Taiwanese motherboard OEM;
and a DC/DC switching regulator, for a major Japanese brand
digital-still-camera.
|
·
|
Also
in power conversion, ST introduced into the market a new 10-12A
overvoltage-protected AC switch series, aimed at helping white goods
meet the latest energy and safety standards. ST also enlarged
its high-junction-temperature TRIAC family with a new sensitive
series dedicated to small appliances and industrial
systems.
|
·
|
In
power MOSFETs, ST introduced a 250A power MOSFET with the lowest
on-resistance in the market and a new family of devices based on the
company’s innovative SuperMESH3 technology to increase the ruggedness,
switching performance and efficiency of lighting ballasts and switch-mode
power-supply applications. ST gained multiple design wins for its MOSFETs,
primarily in lighting and power-supply applications, including one with a
leading PC motherboard maker. In power bipolar devices, ST’s low-voltage
bipolars were qualified for use by a major smart-metering-system customer.
And in linear and interface devices, ST gained design wins in various
markets, including automotive and audio
applications.
|
·
|
In
advanced analog and logic ICs, ST announced a highly integrated RGB LED
driver and gained design wins for its logic ICs with major notebook PC
makers in China and Japan, and with a leading Japanese LCD TV
maker.
|
·
|
In
analog and mixed-signal ICs, ST announced a new series of
clock-distribution ICs and also sampled clock-distribution ICs to two
major Asian mobile-phone customers. Additionally, reset and temperature
sensors were designed-in at a major HDD maker and a real-time clock IC was
designed-in at a major GPS
manufacturer.
|
·
|
ST,
Infineon Technologies and STATS ChipPAC announced an agreement to jointly
develop the next-generation of embedded Wafer-Level Ball Grid Array (eWLB)
technology for use in manufacturing future-generation semiconductor
packages.
|
·
|
ST
and the Waseda University Humanoid Robotics Institute (HRI) announced the
development of a high-performance, two-wheel inverted-pendulum robot,
called WV-1, which is the first result of an ongoing cooperation for the
research and development of technology and solutions for innovative
humanoid robots and medical-care robot
systems.
|
·
|
further
deterioration on the worldwide financial markets, economic recession in
one or more of the world’s major economies and the effect on demand for
semiconductor products in the key application markets and from key
customers served by our products , which in turn makes it extremely
difficult to accurately forecast and plan future business
activities;
|
·
|
our
ability to adequately utilize and operate our manufacturing facilities at
sufficient levels to cover fixed operating costs particularly at a time of
decreasing demand for our products due to decline in demand for
semiconductor products;
|
·
|
pricing
pressures which are highly variable and difficult to
predict;
|
·
|
the
results of actions by our competitors, including new product offerings and
our ability to react thereto;
|
·
|
the
financial impact of obsolete or excess inventories if actual demand
differs from our
anticipations;
|
·
|
the
impact of intellectual-property claims by our competitors or other third
parties, and our ability to obtain required licenses on reasonable terms
and conditions;
|
·
|
the
outcome of ongoing litigation as well as any new litigation to which we
may become a defendant;
|
·
|
our
ability to close as planned the merger of ST-NXP Wireless with Ericsson
Mobile Platforms as announced on August 20,
2008;
|
·
|
the
effects of hedging, which we practice in order to minimize the impact of
variations between the U.S. dollar and the currencies of the
other major countries in which we have our operating infrastructure in the
currently very volatile currency
environments;
|
·
|
our
ability to manage in an intensely competitive and cyclical industry, where
a high percentage of our costs are fixed, incurred in currencies other
than US dollars;
|
·
|
our
ability to restructure in accordance with our plans if
unforeseen events require adjustments or delays in
implementation;
|
·
|
our
ability in an intensively competitive environment to secure customer
acceptance and to achieve our pricing expectations for high-volume
supplies of new products in whose development we have been, or are
currently, investing;
|
·
|
the
ability of our suppliers to meet our demands for supplies and materials
and to offer competitive
pricing;
|
·
|
significant
differences in the gross margins we achieve compared to expectations,
based on changes in revenue levels, product mix and pricing, capacity
utilization, variations in inventory valuation, excess or obsolete
inventory, manufacturing yields, changes in unit costs, impairments of
long-lived assets (including manufacturing, assembly/test and intangible
assets), and the timing, execution and associated costs for the
announced transfer of manufacturing from facilities designated
for closure and associated costs, including start-up
costs;
|
·
|
changes
in the economic, social or political environment, including military
conflict and/or terrorist activities, as well as natural events such as
severe weather, health risks, epidemics or earthquakes in the countries in
which we, our key customers and our suppliers, operate;
and
|
·
|
changes
in our overall tax position as a result of changes in tax laws or the
outcome of tax audits, and our ability to accurately estimate tax credits,
benefits, deductions and provisions and to realize deferred tax
assets.
|
STMicroelectronics N.V.
|
||||||||
Consolidated
Statements of Income
|
||||||||
(in
millions of U.S. dollars, except per share data ($))
|
||||||||
Three
Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
September
27,
|
September
29,
|
|||||||
2008
|
2007
|
|||||||
Net
sales
|
2,687 | 2,555 | ||||||
Other
revenues
|
9 | 10 | ||||||
NET
REVENUES
|
2,696 | 2,565 | ||||||
Cost
of sales
|
-1,737 | -1,663 | ||||||
GROSS
PROFIT
|
959 | 902 | ||||||
Selling,
general and administrative
|
-297 | -272 | ||||||
Research
and development
|
-602 | -442 | ||||||
Other
income and expenses, net
|
17 | 24 | ||||||
Impairment,
restructuring charges and other related closure costs
|
-22 | -31 | ||||||
Total
Operating Expenses
|
-904 | -721 | ||||||
OPERATING
INCOME
|
55 | 181 | ||||||
Other-than-temporary
impairment charge on financial assets
|
-14 | 0 | ||||||
Interest
income, net
|
8 | 22 | ||||||
Earnings
(loss) on equity investments
|
-344 | 3 | ||||||
INCOME
(LOSS) BEFORE INCOME TAXES
|
-295 | 206 | ||||||
AND
MINORITY INTERESTS
|
||||||||
Income
tax benefit (expense)
|
15 | -18 | ||||||
INCOME
(LOSS) BEFORE MINORITY INTERESTS
|
-280 | 188 | ||||||
Minority
interests
|
-9 | -1 | ||||||
NET
INCOME (LOSS)
|
-289 | 187 | ||||||
EARNINGS
(LOSS) PER SHARE (BASIC)
|
-0.32 | 0.21 | ||||||
EARNINGS
(LOSS) PER SHARE (DILUTED)
|
-0.32 | 0.20 | ||||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
||||||||
DILUTED
INCOME (LOSS) PER SHARE
|
890.3 | 945.2 |
STMicroelectronics N.V.
|
||||||||
Consolidated
Statements of Income
|
||||||||
(in millions
of U.S. dollars, except per share data ($))
|
||||||||
Nine
Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
September
27,
|
September
29,
|
|||||||
2008
|
2007
|
|||||||
Net
sales
|
7,528 | 7,233 | ||||||
Other
revenues
|
38 | 25 | ||||||
NET
REVENUES
|
7,566 | 7,258 | ||||||
Cost
of sales
|
-4,828 | -4,733 | ||||||
GROSS
PROFIT
|
2,738 | 2,525 | ||||||
Selling,
general and administrative
|
-882 | -803 | ||||||
Research
and development
|
-1,581 | -1,322 | ||||||
Other
income and expenses, net
|
56 | 20 | ||||||
Impairment,
restructuring charges and other related closure costs
|
-390 | -949 | ||||||
Total
Operating Expenses
|
-2,797 | -3,054 | ||||||
OPERATING
LOSS
|
-59 | -529 | ||||||
Other-than-temporary
impairment charge on financial assets
|
-82 | 0 | ||||||
Interest
income, net
|
48 | 57 | ||||||
Earnings
(loss) on equity investments
|
-350 | 12 | ||||||
LOSS
BEFORE INCOME TAXES
|
-443 | -460 | ||||||
AND
MINORITY INTERESTS
|
||||||||
Income
tax benefit (expense)
|
34 | -32 | ||||||
LOSS
BEFORE MINORITY INTERESTS
|
-409 | -492 | ||||||
Minority
interests
|
-12 | -4 | ||||||
NET
LOSS
|
-421 | -496 | ||||||
LOSS
PER SHARE (BASIC)
|
-0.47 | -0.55 | ||||||
LOSS
PER SHARE (DILUTED)
|
-0.47 | -0.55 | ||||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
||||||||
DILUTED
LOSS PER SHARE
|
896.8 | 898.5 |
STMicroelectronics
N.V.
|
||||||||||||
CONSOLIDATED
STATEMENTS OF CASH FLOWS
|
||||||||||||
Three
Months
Ended |
Nine
Months
Ended |
|||||||||||
September
27,
|
September
27,
|
September
29,
|
||||||||||
(in
millions of U.S. dollars)
|
2008
|
2008
|
2007
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Unaudited)
|
||||||||||
Cash
flows from operating activities:
|
||||||||||||
Net
loss
|
-289 | -421 | -496 | |||||||||
Items
to reconcile net income (loss) and cash flows from operating
activities
|
||||||||||||
Depreciation
and amortization
|
343 | 1,009 | 1,079 | |||||||||
Amortization
of discount on convertible debt
|
4 | 13 | 13 | |||||||||
Other-than-temporary
impairment charge on financial assets
|
14 | 82 | 0 | |||||||||
Other
non-cash items
|
62 | 73 | 78 | |||||||||
Minority
interests in net income of subisidiaries
|
9 | 12 | 4 | |||||||||
Deferred
income tax
|
-38 | -41 | -13 | |||||||||
(Earnings)
loss on equity investments
|
344 | 350 | -12 | |||||||||
Impairment,
restructuring charges and other related closure costs, net of cash
payments
|
-4 | 333 | 905 | |||||||||
Changes
in assets and liabilities:
|
||||||||||||
Trade
receivables, net
|
0 | 165 | -36 | |||||||||
Inventories,
net
|
46 | -133 | 9 | |||||||||
Trade
payables
|
-42 | 101 | -45 | |||||||||
Other
assets and liabilities, net
|
-35 | -211 | -35 | |||||||||
Net
cash from operating activities
|
414 | 1,332 | 1,451 | |||||||||
Cash
flows from investing activities:
|
||||||||||||
Payment
for purchases of tangible assets
|
-247 | -777 | -735 | |||||||||
Payment
for purchases of marketable securities
|
0 | 0 | -708 | |||||||||
Proceeds
from sale of marketable securities
|
127 | 287 | 100 | |||||||||
Proceeds
from matured short-term deposits
|
0 | 0 | 250 | |||||||||
Restricted
cash for equity investments
|
0 | 0 | -32 | |||||||||
Investment
in intangible and financial assets
|
-27 | -68 | -64 | |||||||||
Payment
for business acquisitions, net of cash and cash equivalents
acquired
|
-1,517 | -1,687 | 0 | |||||||||
Net
cash used in investing activities
|
-1,664 | -2,245 | -1,189 | |||||||||
Cash
flows from financing activities:
|
||||||||||||
Proceeds
from long-term debt
|
251 | 387 | 82 | |||||||||
Proceeds
from repurchase agreements
|
249 | 249 | 0 | |||||||||
Extinguishment
of obligations under repurchase agreements
|
-249 | -249 | 0 | |||||||||
Repayment
of long-term debt
|
-13 | -64 | -112 | |||||||||
Capital
increase
|
0 | 0 | 2 | |||||||||
Repurchase
of common stock
|
-148 | -231 | 0 | |||||||||
Dividends
paid
|
-80 | -161 | -269 | |||||||||
Dividends
paid to minority interests
|
0 | 0 | -6 | |||||||||
Net
cash from (used in) financing activities
|
10 | -69 | -303 | |||||||||
Effect
of changes in exchange rates
|
-28 | -5 | 32 | |||||||||
Net
cash decrease
|
-1,268 | -987 | -9 | |||||||||
Cash
and cash equivalents at beginning of the period
|
2,136 | 1,855 | 1,659 | |||||||||
Cash
and cash equivalents at end of the period
|
868 | 868 | 1,650 |
STMicroelectronics
N.V.
|
||||||||||||
CONSOLIDATED
BALANCE SHEETS
|
||||||||||||
As
at
|
September
27,
|
June
28,
|
December
31,
|
|||||||||
(in
millions of U.S. dollars)
|
2008
|
2008
|
2007
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Audited)
|
||||||||||
ASSETS
|
||||||||||||
Current
assets:
|
||||||||||||
Cash
and cash equivalents
|
868 | 2,136 | 1,855 | |||||||||
Marketable
securities
|
726 | 898 | 1,014 | |||||||||
Trade
accounts receivable, net
|
1,520 | 1,473 | 1,605 | |||||||||
Inventories,
net
|
1,787 | 1,580 | 1,354 | |||||||||
Deferred
tax assets
|
252 | 246 | 205 | |||||||||
Assets
held for sale
|
0 | 61 | 1,017 | |||||||||
Receivables,
net on transactions on-behalf
|
72 | |||||||||||
Other
receivables and assets
|
694 | 734 | 612 | |||||||||
Total
current assets
|
5,919 | 7,128 | 7,662 | |||||||||
Goodwill
|
1,030 | 315 | 290 | |||||||||
Other
intangible assets, net
|
904 | 309 | 238 | |||||||||
Property,
plant and equipment, net
|
5,065 | 5,059 | 5,044 | |||||||||
Long-term
deferred tax assets
|
370 | 283 | 237 | |||||||||
Equity
investments
|
691 | 1,032 | 0 | |||||||||
Restricted
cash
|
250 | 250 | 250 | |||||||||
Non-current
marketable securities
|
297 | 300 | 369 | |||||||||
Other
investments and other non-current assets
|
458 | 377 | 182 | |||||||||
9,065 | 7,925 | 6,610 | ||||||||||
Total
assets
|
14,984 | 15,053 | 14,272 | |||||||||
LIABILITIES
AND SHAREHOLDERS' EQUITY
|
||||||||||||
Current
liabilities:
|
||||||||||||
Current
portion of long-term debt
|
63 | 153 | 103 | |||||||||
Trade
accounts payable
|
1,156 | 1,161 | 1,065 | |||||||||
Other
payables and accrued liabilities
|
1,165 | 981 | 744 | |||||||||
Dividends
payable to shareholders
|
163 | 242 | 0 | |||||||||
Deferred
tax liabilities
|
19 | 10 | 11 | |||||||||
Accrued
income tax
|
142 | 132 | 154 | |||||||||
Total
current liabilities
|
2,708 | 2,679 | 2,077 | |||||||||
Long-term
debt
|
2,487 | 2,313 | 2,117 | |||||||||
Reserve
for pension and termination indemnities
|
301 | 304 | 323 | |||||||||
Long-term
deferred tax liabilities
|
109 | 33 | 14 | |||||||||
Other
non-current liabilities
|
323 | 311 | 115 | |||||||||
3,220 | 2,961 | 2,569 | ||||||||||
Total
liabilities
|
5,928 | 5,640 | 4,646 | |||||||||
Commitment
and contingencies
|
||||||||||||
Minority
interests
|
290 | 56 | 53 | |||||||||
Common stock (preferred
stock: 540,000,000 shares authorized, not
issued;
common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,307,305 shares
issued,
883,460,327 shares
outstanding)
|
1,156 | 1,156 | 1,156 | |||||||||
Capital
surplus
|
2,311 | 2,145 | 2,097 | |||||||||
Accumulated
result
|
4,444 | 4,736 | 5,274 | |||||||||
Accumulated
other comprehensive income
|
1,276 | 1,593 | 1,320 | |||||||||
Treasury
stock
|
-421 | -273 | -274 | |||||||||
Shareholders'
equity
|
8,766 | 9,357 | 9,573 | |||||||||
Total
liabilities and shareholders' equity
|
14,984 | 15,053 | 14,272 |
STMicroelectronics N.V. | |||
Date:
October 29, 2008
|
By:
|
/s/ Carlo Ferro | |
Name: | Carlo Ferro | ||
Title: | Executive Vice President and | ||
Chief Financial Officer |