·
|
Second
quarter net revenues increased 9.7% sequentially and 14.6% year-over-year
to $2.39 billion
|
·
|
Gross
margin was 36.8%
|
·
|
Diluted
EPS of $0.18 before restructuring and impairment
charges
|
In
Million US$ and %
|
||||
Effective
Euro/USD
|
Q2
2008
As reported $1.55 |
Q2
2007
Excluding FMG $1.33 |
Estimated
impact on selected Q2 2008 results at
Q2 2007 exchange rates* |
|
Estimated
Adverse Impact |
Estimated
Q2 2008 results at
constant currency |
|||
Net
Revenues
|
2,391
|
2,087
|
||
Gross
Profit
|
880
|
788
|
75
|
955
|
Gross
margin
|
36.8%
|
37.8%
|
310 basis
points
|
39.9%
|
R&D
|
(470)
|
(397)
|
39
|
(431)
|
SG&A
|
(281)
|
(243)
|
29
|
(252)
|
**Pro-forma
Operating income: excluding
Impairment & Restructuring charges
|
159
|
159
|
134
|
293
|
As
% of Net Revenues
|
Q2
2008
|
Market
Segment
|
ST
|
Automotive
|
17%
|
Consumer
|
17%
|
Computer
|
16%
|
Telecom
|
32%
|
Industrial
& Other
|
18%
|
In
Million US$ and %
|
Q2
2008
|
||
Segment
|
Net
Revenues |
%
of Net
Revenues |
Operating
income
(loss) |
ASG
(Application Specific Product Groups)
|
$1,511
|
63.2%
|
$35
|
IMS
(Industrial and Multisegment Sector)
|
865
|
36.2%
|
132
|
Others
(1)(2)
|
15
|
0.6%
|
(193)
|
TOTAL
|
$2,391
|
100%
|
$(26)
|
In
Million US$ and %
|
|||
Net
Revenues
|
First
Half 2008
|
First
Half 2007
|
Year-over-Year
Growth |
ST
ex FMG
|
$4,570
|
$4,039
|
13.2%
|
ST
including FMG
|
$4,869
|
$4,693
|
3.8%
|
In
Million US$ and %
|
First
Half 2008
|
||
Product
Segment
|
Net
Revenues |
%
of Net
Revenues |
Operating
income
(loss) |
ASG
(Application Specific Product Groups)
|
$2,904
|
59.7%
|
$42
|
IMS
(Industrial and Multisegment Sector)
|
1,637
|
33.6%
|
222
|
FMG
(Flash Memories Group)
|
299
|
6.1%
|
16
|
Others
(1)(2)
|
29
|
0.6%
|
(394)
|
TOTAL
|
$4,869
|
100%
|
$(114)
|
·
|
At
the Company’s Annual General Meeting, which was held in Amsterdam on May
14, 2008, all of the proposed resolutions were approved. The Company’s
2007 accounts in accordance with International Financial Reporting
Standards (IFRS) were approved. The shareholders reappointed the
following members of the Supervisory Board: Mr. Gérald Arbola, Mr. Tom de
Waard, Mr. Didier Lombard, Mr. Bruno Steve, in addition to appointing Mr.
Antonino Turicchi, for three-year terms, expiring at the 2011 Annual
General Meeting. The distribution of a cash dividend of $0.36 per share,
to be paid in four equal installments, was also
approved.
|
º
|
The
complete Agenda and relevant detailed information concerning the
STMicroelectronics N.V. Annual General Meeting, as well as all related AGM
materials, is available on the Company’s website http://investors.st.com
|
·
|
On
June 26, 2008, ST and NXP announced that the name of their new joint
venture will be ST-NXP Wireless, following the announcement on April 10,
2008, that the two companies would create a new company from their
respective mobile and wireless businesses, which together generated US$3
billion in revenue in 2007. The management team of ST-NXP Wireless will be
comprised of experienced industry leaders from both parent companies, with
Alain Dutheil leading ST-NXP Wireless as Chief Executive Officer. The new
company will begin operations in a strong position to meet customer needs
in 2G, 2.5G, 3G, multimedia, connectivity and future wireless
technologies.
|
·
|
On
June 30, 2008, ST published its 2007 Corporate Responsibility Report,
which is available for download at www.st.com/cr. The report, which covers
all of ST’s activities and sites in 2007, contains detailed indicators of
the Company’s performance across the full range of Social, Environmental,
Health & Safety, and Corporate Governance issues and reaffirms ST’s
long-established commitment to serving its stakeholders with integrity,
transparency and excellence.
|
·
|
In
wireless, ST announced the intention to develop an analog baseband for a
future high-volume EMP (Ericsson Mobile Platforms) platform, within the
existing partnership between the two companies. This effort builds upon
the successful joint development and the start of production of 3G and
3.5G digital baseband processors for EMP’s
licensees.
|
·
|
Also
in the wireless area, due to its expertise in mobile multimedia, ST was
nominated as one of the founding members of the Symbian Foundation, along
with other major leaders in the mobile handset industry. The intention of
the Foundation is to unite leading operating systems to create one open
mobile software platform. As part of its membership, ST is to contribute
some of its IP and reference platforms to the
foundation.
|
·
|
In
communications infrastructure applications, ST gained five design wins
from three leading OEMs for devices implemented in 65nm process
technology, some of which included embedded DRAM and other analog options,
confirming ST’s leading position in delivering CMOS-derivative process
technology to infrastructure
customers.
|
·
|
In
imaging, ST introduced a new high-performance stand-alone Image Signal
Processor with dual-camera support that brings DSC-like performance to
cellphones, PDAs, gaming devices and other mobile applications. Capable of
controlling the entire imaging subsystem in a
|
|
mobile
phone, the processor supports a wide range of modules including sensors
with up to 5-megapixel resolution.
|
·
|
In
digital consumer, ST continued to increase shipments of its leading-edge
H.264 decoder chips for the worldwide deployment of high-definition
digital set-top-boxes and integrated digital TVs. ST has also sampled four
different products, implemented in 65nm, to world-leading manufacturers,
targeting key segments of the set-top box
market.
|
·
|
In
automotive, ST announced the first four 32-bit microcontrollers in the
company’s new Power Architecture™ families, enabling integrators to use
the MCUs in powertrain, car body, chassis and safety, and instrumentation
systems. The devices will support advanced functions, enable improved
vehicle performance and economy, and deliver development savings by
promoting hardware and software
reuse.
|
·
|
In
powertrain applications, ST gained a significant design win for a dynamic
vehicle control and ABS (anti-lock braking system) platform from a major
Japanese car maker. Based on ST’s BCD8 smart-power process, the
single-chip products will serve the full platform from simple ABS
solutions for low- and mid-level cars to full vehicle control for the
high-end segment. In car safety, ST and Mobileye announced that the two
companies have sampled the second generation of the EyeQ2 system-on-chip
for vision-based driver assistance systems. In addition, ST achieved a
major design win from a European tier one OEM for a PSI5-protocol IC,
which provides a simplified and safer interface between the airbag sensor
and car diagnostics. In production in 2009 with European, American and
Japanese car makers, ST will be the first non-captive-market vendor with
an IC handling the PSI5 protocol.
|
·
|
In
car-body applications, ST gained major design wins, including a
door-module chipset in the US market and for smart actuators in
body-control modules in China and India. ST also achieved several
design-ins at tier one OEMs worldwide for 8- and 32-bit
MCUs.
|
·
|
In
car communications, ST signed an agreement with WorldSpace® Satellite
Radio to develop, manufacture and distribute chips for European Satellite
Digital Radio receivers for a pan-European and Middle East service
offering. Also, ST started production of its Nomadik-platform-based
Cartesio automotive-grade application processor with embedded GPS for
three customers for telematics, handheld and Personal Navigation Device
(PND) applications. Additionally, ST gained a design win for an AM/FM
tuner IC at a major US OEM and a tuner design-in at a major Japanese car
radio maker, plus design wins for audio power chips with a Japanese car
radio maker and major US car
manufacturers.
|
·
|
In
computer peripherals, ST gained two design wins in the US for its SPEAr®
family of configurable System on-Chip (SoC) ICs, in printers and
networking applications. Additionally, ST announced a new device in the
family: manufactured in state-of-the-art low-power 65nm technology, SPEAr
Basic addresses various embedded applications, including entry-level
printers, digital photo frames, Voice-over-IP and other
equipment.
|
·
|
In
healthcare applications, ST and Debiotech introduced the first evaluation
prototypes of a unique miniaturized insulin-delivery pump. The device,
which could be a couple of years away from commercial availability, relies
on microfluidic MEMS technology and can be mounted on a disposable skin
patch to provide continuous insulin infusion, enabling substantial
advancements in the availability, treatment efficiency and the quality of
life of diabetes patients.
|
·
|
In
32-bit microcontrollers, ST increased the scalability and peripheral
options of its breakthrough 32-bit STM32 Cortex™-M3 MCU family with
devices providing up to 512 Kbytes of on-chip Flash, larger SRAM and extra
features for displays, sound, storage and advanced control, and multiple
power-saving modes for optimal performance in industrial equipment,
building-services controllers, medical devices and computer peripherals.
In 8-bit MCUs, ST launched a range of MCUs, based on the STM8 core and
specified for the industrial temperature range, that boasts extra features
for robustness and reliability.
|
·
|
In
MEMS, in addition to gaining two significant design wins for sensors in
game controllers and another in a consumer application, ST introduced a
number of important new products, including its first ‘Gyroscope’
angular-rate sensors, which offer an extended voltage range and reduced
standby power for applications such as game controllers, intuitive
pointers, vehicle or personal navigation, and image
stabilization.
|
·
|
Also
in MEMS, ST announced the first in a new family of 3D orientation sensors
that embed both 3D orientation functionality and click/double-click
detection, allowing developers to integrate mouse-button controls. ST also
added two new high-performance accelerometers to its ultra-compact
portfolio for super-small applications where high performance is required
in space-constrained applications, including mobile phones, portable media
players, digital still or video cameras, and personal navigation
devices.
|
·
|
For
power conversion markets, ST gained a significant design win with a major
power-supply manufacturer for a Halogen-free product kit and also ramped
up production of power-converter and regulators ICs for several PC
notebook applications from major customers in the US and Asia. ST also
introduced new products including the VIPer17 off-line switched-mode
converter, step-up converters for LED backlights and lighting, and a new
multi-output regulator aimed at a range of PC and consumer
products.
|
·
|
Also
in power applications, ST gained several design wins for MOSFETS including
high-end desktop PCs for a major customer and applications in automotive
and lighting. ST also announced a family of FDmesh™ II fast-recovery
MOSFETs that combine enhanced switching performance with on-resistance
improved by more than 18% over existing devices. And in bipolar and IGBTs,
ST gained numerous design wins in industrial, medical and audio
applications and introduced a new ESBT switch for power supplies for
single- and three-phase applications and a PowerMESH™ IGBT for use in
energy-sensitive circuits such as lighting
ballasts.
|
·
|
In
application-specific discretes and IPADs™ (Integrated Passive and Active
Devices), ST introduced into the home-appliance market a solid-state
AC-switch driver that integrates switch-failure detection, allowing
designers to save board space and simplify the process to meet various
international safety standards. In telecom and consumer applications, ST
enlarged its IPAD range of combined ESD protection and EMI filtering
products dedicated to audio functions, and also introduced protection
devices dedicated to USB2.0 and Ethernet to meet increasing data rates in
connectivity and wireline
applications.
|
·
|
In
analog products, ST introduced a range of new devices including interfaces
and amplifiers and achieved numerous design wins in a range of
applications, such as mobile phone audio for a world-leading manufacturer
and use in data-storage products for two important customers. And in
advanced analog and mixed-signal, ST announced a new family of silicon
oscillators and a range of four- and five-channel voltage supervisors for
computer, consumer and communications applications, in addition to picking
up several design wins and product qualifications in the advanced analog
field from world-leading makers of mobile phones, computer and
PNDs.
|
·
|
In
advanced logic, ST gained numerous design wins for logic switches and
translators in computer and communications applications from major
notebook and mobile phone manufacturers. ST also announced a new
touch-screen controller IC that offers autonomous functionality to
minimize demands on the system processor in applications such as PDAs,
mobile phones, GPS receivers, game consoles and POS
terminals.
|
·
|
ST
announced the deployment of a certified electronic system-level (ESL)
System-on-Chip reference design flow aimed at complex designs for
next-generation consumer electronics equipment. The design flow
has been adopted and internally distributed following successful tape-outs
of more than a dozen ASIC designs with productivity gains from four to ten
times faster than with traditional
methods.
|
·
|
ST
and CMP (Circuits Multi Projects®) announced that the two companies are
offering Chinese universities access to ST’s most advanced CMOS processes
for academic and research purposes. ST will ensure the certification of
the local partners and the fabrication of the ICs designed by the
universities, while CMP will be the interface for commercial and technical
aspects.
|
·
|
future
developments of the world semiconductor market, in particular the future
demand for semiconductor products in the key application markets and from
key customers served by our
products;
|
·
|
the
results of actions by our competitors, including new product offerings and
our ability to react thereto;
|
·
|
curtailments
of purchases from key customers or pricing pressures which are highly
variable and difficult to predict;
|
·
|
the
financial impact of obsolete or excess inventories if actual demand
differs from our anticipations;
|
·
|
the
impact of intellectual-property claims by our competitors or other third
parties, and our ability to obtain required licenses on reasonable terms
and conditions;
|
·
|
the
outcome of ongoing litigation as well as any new litigation to which we
may become a defendant;
|
·
|
our
ability to close as planned in the third quarter of 2008 the purchase of
the wireless business of NXP Semiconductors, which we announced on April
10, 2008, as well as our ability to sign and close an agreement for the
sale of our manufacturing facility in Phoenix (AZ, USA) in
accordance with the currently envisaged
terms;
|
·
|
changes
in the exchange rates between the US dollar and the Euro, compared to an
assumed effective exchange rate of US $1.57 = €1.00 and between the U.S.
dollar and the currencies of the other major countries in which we have
our operating infrastructure;
|
·
|
our
ability to manage in an intensely competitive and cyclical industry, where
a high percentage of our costs are fixed, incurred in currencies other
than US dollars which is our reporting currency and difficult to reduce in
the short term;
|
·
|
our
ability to adequately utilize and operate our manufacturing facilities at
sufficient levels to cover fixed operating
costs;
|
·
|
our
ability to restructure in accordance with our plans if
unforeseen events require adjustments or delays in
implementation;
|
·
|
our
ability in an intensively competitive environment to secure customer
acceptance and to achieve our pricing expectations for high-volume
supplies of new products in whose development we have been, or are
currently, investing;
|
·
|
the
ability of our suppliers to meet our demands for supplies and materials
and to offer competitive pricing;
|
·
|
significant
differences in the gross margins we achieve compared to expectations,
based on changes in revenue levels, product mix and pricing, capacity
utilization, variations in inventory valuation, excess or obsolete
inventory, manufacturing yields, changes in unit costs, impairments of
long-lived assets (including manufacturing, assembly/test and intangible
assets), and the timing, execution and associated costs for the
announced transfer of manufacturing from facilities designated
for closure and associated costs, including start-up
costs;
|
·
|
changes
in the economic, social or political environment, including military
conflict and/or terrorist activities, as well as natural events such as
severe weather, health risks, epidemics or earthquakes in the countries in
which we, our key customers and our suppliers,
operate;
|
·
|
changes
in our overall tax position as a result of changes in tax laws or the
outcome of tax audits, and our ability to accurately estimate tax credits,
benefits, deductions and provisions and to realize deferred tax assets.
|
STMicroelectronics
N.V.
|
||||||||
Consolidated
Statements of Income
|
||||||||
(in
millions of U.S. dollars, except per share data ($))
|
||||||||
Three
Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
June
28,
|
June
30 ,
|
|||||||
2008
|
2007
|
|||||||
Net
sales
|
2,379 | 2,409 | ||||||
Other
revenues
|
12 | 9 | ||||||
NET
REVENUES
|
2,391 | 2,418 | ||||||
Cost
of sales
|
-1,511 | -1,580 | ||||||
GROSS
PROFIT
|
880 | 838 | ||||||
Selling,
general and administrative
|
-281 | -270 | ||||||
Research
and development
|
-470 | -446 | ||||||
Other
income and expenses, net
|
30 | 12 | ||||||
Impairment,
restructuring charges and other related closure costs
|
-185 | -906 | ||||||
Total
Operating Expenses
|
-906 | -1,610 | ||||||
OPERATING
LOSS
|
-26 | -772 | ||||||
Other-than-temporary
impairment charge on financial assets
|
-39 | 0 | ||||||
Interest
income, net
|
19 | 18 | ||||||
Earnings
(loss) on equity investments
|
-5 | 3 | ||||||
LOSS
BEFORE INCOME TAXES
|
-51 | -751 | ||||||
AND
MINORITY INTERESTS
|
||||||||
Income
tax benefit (expense)
|
5 | -4 | ||||||
LOSS
BEFORE MINORITY INTERESTS
|
-46 | -755 | ||||||
Minority
interests
|
-1 | -3 | ||||||
NET
LOSS
|
-47 | -758 | ||||||
LOSS
PER SHARE (BASIC)
|
-0.05 | -0.84 | ||||||
LOSS
PER SHARE (DILUTED)
|
-0.05 | -0.84 | ||||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
||||||||
DILUTED
LOSS PER SHARE
|
900.5 | 898.8 |
STMicroelectronics
N.V.
|
||||||||
Consolidated
Statements of Income
|
||||||||
(in
millions of U.S. dollars, except per share data ($))
|
||||||||
Six
Months Ended
|
||||||||
(Unaudited)
|
(Unaudited)
|
|||||||
June
28,
|
June
30,
|
|||||||
2008
|
2007
|
|||||||
Net
sales
|
4,841 | 4,678 | ||||||
Other
revenues
|
28 | 15 | ||||||
NET
REVENUES
|
4,869 | 4,693 | ||||||
Cost
of sales
|
-3,090 | -3,070 | ||||||
GROSS
PROFIT
|
1,779 | 1,623 | ||||||
Selling,
general and administrative
|
-585 | -531 | ||||||
Research
and development
|
-978 | -881 | ||||||
Other
income and expenses, net
|
39 | -3 | ||||||
Impairment,
restructuring charges and other related closure costs
|
-369 | -918 | ||||||
Total
Operating Expenses
|
-1,893 | -2,333 | ||||||
OPERATING
LOSS
|
-114 | -710 | ||||||
Other-than-temporary
impairment charge
|
-69 | 0 | ||||||
Interest
income, net
|
40 | 36 | ||||||
Earnings
(loss) on equity investments
|
-5 | 9 | ||||||
LOSS
BEFORE INCOME TAXES
|
-148 | -665 | ||||||
AND
MINORITY INTERESTS
|
||||||||
Income
tax benefit (expense)
|
19 | -15 | ||||||
LOSS
BEFORE MINORITY INTERESTS
|
-129 | -680 | ||||||
Minority
interests
|
-2 | -4 | ||||||
NET
LOSS
|
-131 | -684 | ||||||
LOSS
PER SHARE (BASIC)
|
-0.15 | -0.76 | ||||||
LOSS
PER SHARE (DILUTED)
|
-0.15 | -0.76 | ||||||
NUMBER
OF WEIGHTED AVERAGE
|
||||||||
SHARES
USED IN CALCULATING
|
||||||||
DILUTED
LOSS PER SHARE
|
900.1 | 898.1 |
STMicroelectronics
N.V.
|
||||||||||||
CONSOLIDATED
STATEMENTS OF CASH FLOWS
|
||||||||||||
Three
Months Ended
|
Six
Months Ended
|
|||||||||||
June
28,
|
June
28,
|
June
30,
|
||||||||||
In
millions of U.S. dollars
|
2008
|
2008
|
2007
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Unaudited)
|
||||||||||
Cash
flows
from operating activities:
|
||||||||||||
Net
loss
|
-47 | -131 | -684 | |||||||||
Items
to reconcile net loss and cash flows from operating
activities
|
||||||||||||
Depreciation
and amortization
|
325 | 666 | 770 | |||||||||
Amortization
of discount on convertible debt
|
5 | 9 | 9 | |||||||||
Other-than-temporary
impairment charge on financial assets
|
39 | 69 | 0 | |||||||||
Other
non-cash items
|
-10 | 11 | 39 | |||||||||
Minority
interests
|
1 | 2 | 4 | |||||||||
Deferred
income tax
|
-32 | -3 | -7 | |||||||||
(Earnings)
loss on equity investments
|
5 | 5 | -9 | |||||||||
Impairment,
restructuring charges and other related closure costs, net of cash
payments
|
170 | 337 | 885 | |||||||||
Changes
in assets and liabilities:
|
||||||||||||
Trade
receivables, net
|
69 | 165 | 46 | |||||||||
Inventories,
net
|
-37 | -179 | -53 | |||||||||
Trade
payables
|
58 | 143 | -2 | |||||||||
Other
assets and liabilities, net
|
-130 | -176 | -58 | |||||||||
Net
cash from operating activities
|
416 | 918 | 940 | |||||||||
Cash
flows from investing activities:
|
||||||||||||
Payment
for purchase of tangible assets
|
-272 | -530 | -507 | |||||||||
Payment
for purchase of marketable securities
|
0 | 0 | -682 | |||||||||
Proceeds
from sale of marketable securities
|
160 | 160 | 40 | |||||||||
Proceeds
from matured short-term deposits
|
0 | 0 | 250 | |||||||||
Restricted
cash
|
0 | 0 | -32 | |||||||||
Investment
in intangible and financial assets
|
-16 | -41 | -36 | |||||||||
Payment
for business acquisitions, net of cash and cash equivalents
acquired
|
0 | -170 | 0 | |||||||||
Net
cash used in investing activities
|
-128 | -581 | -967 | |||||||||
Cash
flows from financing activities:
|
||||||||||||
Proceeds
from issuance of long-term debt
|
0 | 136 | 17 | |||||||||
Repayment
of long-term debt
|
|
-44 | -51 | -52 | ||||||||
Increase
in short-term facilities
|
0 | 0 | 40 | |||||||||
Capital
increase
|
0 | 0 | 2 | |||||||||
Repurchase
of common stock
|
-83 | -83 | 0 | |||||||||
Dividends
paid
|
-81 | -81 | -269 | |||||||||
Net
cash used in financing activities
|
-208 | -79 | -262 | |||||||||
Effect
of changes in exchange rates
|
-4 | 23 | 4 | |||||||||
Net
cash increase (decrease)
|
76 | 281 | -285 | |||||||||
Cash
and cash equivalents at beginning of the period
|
2,060 | 1,855 | 1,659 | |||||||||
Cash
and cash equivalents at end of the period
|
2,136 | 2,136 | 1,374 |
STMicroelectronics
N.V.
|
||||||||||||
CONSOLIDATED
BALANCE SHEETS
|
||||||||||||
As at
|
June
28,
|
March
30,
|
December
31,
|
|||||||||
In
millions of U.S. dollars
|
2008
|
2008
|
2007
|
|||||||||
(Unaudited)
|
(Unaudited)
|
(Audited)
|
||||||||||
ASSETS
|
||||||||||||
Current
assets:
|
||||||||||||
Cash
and cash equivalents
|
2,136 | 2,060 | 1,855 | |||||||||
Marketable
securities
|
898 | 1,060 | 1,014 | |||||||||
Trade
accounts receivable, net
|
1,473 | 1,546 | 1,605 | |||||||||
Inventories,
net
|
1,580 | 1,539 | 1,354 | |||||||||
Deferred
tax assets
|
246 | 230 | 205 | |||||||||
Assets
held for sale
|
61 | 0 | 1,017 | |||||||||
Other
receivables and assets
|
734 | 626 | 612 | |||||||||
Total
current assets
|
7,128 | 7,061 | 7,662 | |||||||||
Goodwill
|
315 | 314 | 290 | |||||||||
Other
intangible assets, net
|
309 | 317 | 238 | |||||||||
Property,
plant and equipment, net
|
5,059 | 5,391 | 5,044 | |||||||||
Long-term
deferred tax assets
|
283 | 270 | 237 | |||||||||
Equity
investments
|
1,032 | 1,035 | 0 | |||||||||
Restricted
cash
|
250 | 250 | 250 | |||||||||
Non-current
marketable securities
|
300 | 339 | 369 | |||||||||
Other
investments and other non-current assets
|
377 | 357 | 182 | |||||||||
7,925 | 8,273 | 6,610 | ||||||||||
Total
assets
|
15,053 | 15,334 | 14,272 | |||||||||
LIABILITIES
AND SHAREHOLDERS' EQUITY
|
||||||||||||
Current
liabilities:
|
||||||||||||
Current
portion of long-term debt
|
153 | 300 | 103 | |||||||||
Trade
accounts payable
|
1,161 | 1,114 | 1,065 | |||||||||
Other
payables and accrued liabilities
|
981 | 912 | 744 | |||||||||
Dividends
payable to shareholders
|
242 | 0 | 0 | |||||||||
Deferred
tax liabilities
|
10 | 13 | 11 | |||||||||
Accrued
income tax
|
132 | 139 | 154 | |||||||||
Total
current liabilities
|
2,679 | 2,478 | 2,077 | |||||||||
Long-term
debt
|
2,313 | 2,324 | 2,117 | |||||||||
Reserve
for pension and termination indemnities
|
304 | 302 | 323 | |||||||||
Long-term
deferred tax liabilities
|
33 | 32 | 14 | |||||||||
Other
non-current liabilities
|
311 | 306 | 115 | |||||||||
2,961 | 2,964 | 2,569 | ||||||||||
Total
liabilities
|
5,640 | 5,442 | 4,646 | |||||||||
Commitment
and contingencies
|
||||||||||||
Minority
interests
|
56 | 54 | 53 | |||||||||
Common
stock (preferred stock: 540,000,000 shares authorized, not
issued;
|
1,156 | 1,156 | 1,156 | |||||||||
common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,307,305 shares
|
||||||||||||
issued,
896,245,351 shares outstanding)
|
||||||||||||
Capital
surplus
|
2,145 | 2,131 | 2,097 | |||||||||
Accumulated
result
|
4,736 | 5,190 | 5,274 | |||||||||
Accumulated
other comprehensive income
|
1,593 | 1,635 | 1,320 | |||||||||
Treasury
stock
|
-273 | -274 | -274 | |||||||||
Shareholders'
equity
|
9,357 | 9,838 | 9,573 | |||||||||
Total
liabilities and shareholders' equity
|
15,053 | 15,334 | 14,272 |
STMicroelectronics
N.V.
|
||||
Date:
July 23, 2008
|
By:
|
/s/
Carlo
Ferro
|
||
Name:
|
Carlo Ferro | |||
Title:
|
Executive Vice President and | |||
Chief Financial Officer |