·
|
First quarter net revenues
increased 8.9% year-over-year to $2.5 billion, and excluding Flash
Memories Group, net revenues increased 11.6% to $2.2
billion
|
·
|
Gross margin, excluding Flash
Memories Group, was 37.6%
|
·
|
Diluted EPS $0.13 before
restructuring and one-time
charges
|
In
Million US$ and %
|
||
Q1
2008
|
Q1
2007
|
|
Net
Revenues
|
2,478
|
2,276
|
ST
ex FMG
|
2,179
|
1,953
|
FMG
|
299
|
323
|
Gross
Profit
|
899
|
785
|
Gross
margin
|
36.3% *
|
34.5%
|
Gross
margin ex FMG
|
37.6%
|
37.0%
|
In
Million US$ and %
|
||||
Effective
USD/Euro
|
Q1
2008
as
reported
$1.47
|
Q1
2007
as
reported
$1.29
|
Estimated
impact on selected Q1 2008 results at
Q1
2007 exchange rates*
|
|
Estimated
Adverse Impact
|
Estimated
Q1 2008 results at constant currency
|
|||
Net
Revenues
|
2,478
|
2,276
|
||
Gross
Profit
|
899
|
785
|
74
|
973
|
Gross
margin
|
36.3%
|
34.5%
|
300
basis points
|
39.3%
|
R&D
|
(509)
|
(435)
|
43
|
(466)
|
SG&A
|
(304)
|
(261)
|
29
|
(275)
|
**Pro-forma
Operating income: excluding
Impairment & Restructuring and In-process R&D
charges
|
116
|
74
|
143
|
259
|
As
% of Net Revenues
|
Q1
2008
|
|
Market
Segment
|
ST
|
ST
excluding FMG
|
Automotive
|
16%
|
18%
|
Consumer
|
17%
|
17%
|
Computer
|
16%
|
17%
|
Telecom
|
35%
|
31%
|
Industrial
& Other
|
16%
|
17%
|
In
Million US$ and %
|
Q1
2008
|
||
Segment
|
Net
Revenues
|
%
of Net Revenues
|
Operating
income (loss)
|
ASG
(Application Specific Product Groups)
|
$1,393
|
56.2%
|
$7
|
IMS
(Industrial and Multisegment Sector)
|
772
|
31.2%
|
90
|
FMG
(Flash Memories Group)
|
299
|
12.1%
|
16
|
Others
(1)(2)
|
14
|
0.5%
|
(201)
|
TOTAL
|
$2,478
|
100%
|
$(88)
|
|
·
|
Approval
of the Company’s 2007 accounts reported in accordance with International
Financial Reporting Standards (IFRS). (2007 accounts reported in
accordance with U.S. GAAP were filed on SEC Form 20-F on March 3,
2008.)
|
|
·
|
The
reappointment for a three-year term, expiring at the 2011 Annual General
Meeting, of Carlo Bozotti, as the sole member of the Managing Board and
the Company’s President and CEO.
|
|
·
|
The
reappointment for a three-year term, expiring at the 2011 Annual General
Meeting, for the following members of the Supervisory Board: Mr. Gérald
Arbola, Mr. Tom de Waard, Mr. Didier Lombard and Mr. Bruno Steve, and the
appointment to the Supervisory Board, for a three-year term expiring at
the 2011 Annual General Meeting, of Mr. Antonino
Turicchi.
|
|
·
|
The
distribution of a cash dividend of US$0.36 per share, to be paid in four
equal quarterly installments in May, August, and November 2008 and
February 2009 to shareholders of record in the month of each quarterly
payment. If
approved, for the first installment, the Company's common shares will
trade ex-dividend on the three stock exchanges on which they are listed,
on Monday May 19, 2008. For holders of shares listed on Euronext Paris and
the Milan Stock Exchange (Borsa Italiana), Monday, May 19, 2008 will also
be the payment date. For holders of shares listed on the New York Stock
Exchange, the record date will be Wednesday, May 21, 2008, and the payment
date will be on or after Tuesday, May 27, 2008. Transfers between New York
and European (Dutch) registered shares will be closed from the end of
business in Europe on Friday, May 16, 2008, until the open of business in
New York on Thursday, May 22, 2008.
|
|
·
|
On
January 25, ST announced that it had performed all necessary steps to
complete its acquisition of Genesis Microchip, concluded the transaction
and began the integration of
|
|
·
|
On
March 30, ST, Intel and Francisco partners closed the transaction formally
launching their Numonyx flash-memory joint venture, which ST will report
under the equity method of consolidation, deconsolidating from ST’s Income
Statement the results of Flash Memory
Group.
|
|
·
|
On
April 2, ST announced a share repurchase plan, which authorizes the
Company to repurchase up to 30 million shares of ST’s common
stock.
|
|
·
|
On
April 7th,
ST inaugurated its new Greater China headquarters building, in Shanghai.
The ceremony was organized to highlight ST’s determination to further
increase its presence in one of the world’s fastest growing economic
regions.
|
|
·
|
On
April 10th,
ST and NXP announced an agreement to merge portions of their wireless
businesses that together generated $3 billion in revenue during 2007. For
an investment of $1.55 billion, which included a control premium, ST will
own 80% of the joint venture and the companies have agreed on a future
exit mechanism for NXP’s 20% interest that includes put and call options,
exercisable beginning three years from the formation of the
JV.
|
|
·
|
In
mobile communications, ST announced new hardware features of its Nomadik
processor, and multiple platform availability, including Symbian OS/S60,
Linux, Windows Mobile, Windows Embedded CE and the Trolltech Qtopia
application environment. ST also introduced the world’s first 24-bit audio
DAC with Playback Time Extender™ technology for mobile music applications.
The device is especially suitable for mobile phones, as it could enable
the doubling, or more, of the typical music playback time currently
available on cellular phones, to go beyond 20
hours.
|
|
·
|
In
mobile connectivity, ST introduced a 65nm Bluetooth®/FM Radio combo chip
to meet the demanding integration and cost requirements of the mobile
phone market. The IC combines Bluetooth wireless functionality with an FM
radio transceiver, enabling users to play the music stored on their mobile
phone on an FM car radio or home
stereo.
|
|
·
|
In
imaging, ST introduced the market’s smallest 2-megapixel single-chip
camera sensor for mobile applications. Coupling low space requirements
with advanced image-processing capabilities, ST’s latest mobile-phone
camera sensor addresses consumers’ appetite for full-featured imaging
solutions in increasingly popular thin-profile
handsets.
|
|
·
|
In
communications infrastructure, ST gained design wins for two
highly-complex 65nm digital ASICs for a market-leading network-router
customer.
|
|
·
|
In
digital consumer, ST confirmed its leadership position for the shipment of
MPEG-2 and H.264 decoder chips for integrated digital TV sets (iDTVs) for
the European market. ST also introduced a cost-optimized iDTV platform
that provides demodulation, MPEG-2 HD and standard-definition (SD)
decoding, full HD video processing, high-quality audio, and video
switching functions for iDTV sets
worldwide.
|
|
·
|
Additionally,
ST announced a new single-chip HD set-top-box decoder combining both the
demodulation and decoder functions on a single device, designed to meet
the requirements of major satellite operators worldwide, including the
increasingly fast transition to the DVB-S2 satellite broadcast standard,
and allowing OEMs to target the high-volume market for consumers moving to
HD services.
|
|
·
|
Also
in consumer, ST launched a pair of audio chips in its all-digital Sound
Terminal™ Family for home theater audio systems: a new digital power
amplifier that is capable of driving up to 100 watts per channel of audio
into stereo 8-ohm loads; and an audio processor that uses ST’s proprietary
FFX (full flexible amplification) digital modulation
technology.
|
|
·
|
In
computer peripherals, ST gained two SoC design wins from a leading
hard-disk drive (HDD) maker and also launched an HDD motor-control chip
for demanding enterprise-level applications. In printers, ST gained big
design wins in Japan and Korea for its SPEAr™ (Structured Processor
Enhanced Architecture) processor; and one from a major customer for an
ASIC specifically for printers for emerging markets. ST also produced the
first 0.18-micron BCD8 prototypes of a power combo motor driver IC for a
leading printer maker.
|
|
·
|
In
medical applications, following the success of the evaluation trials
conducted at the National University Hospital of Singapore, ST and Veredus
Laboratories announced the commercial availability of VereFlu™, a portable
lab-on-chip application for rapid detection of all major influenza types
at the point of need. VereFlu is a breakthrough molecular diagnostic test
that can detect infection with high accuracy and sensitivity, within two
hours.
|
|
·
|
In
car communications, ST announced that its Nomadik-platform based Cartesio
automotive-grade application processor, with embedded GPS for navigation
and telematics, will enable several products from Garmin, a world leader
in portable navigation. Garmin is to integrate Cartesio in a range of
navigation systems, including its new nüvi 205 Personal Navigation Device.
Additionally, ST announced the industry’s first integrated
power-management chip for MOST (Media Oriented Systems Transport)
networks, which are commonly used in the automotive sector. The chip was
jointly designed with MOST network-processor-market leader
SMSC.
|
|
·
|
In
car radio applications, ST’s three-chip digital broadcasting solution,
which powers SIRIUS Backseat TV™, recently received important recognition
with the application winning the Automotive News PACE (Premier Automotive
Suppliers’ Contribution to Excellence) award. SIRIUS Backseat TV is
offered in Chrysler, Dodge and Jeep
vehicles.
|
|
·
|
In
automotive powertrain applications, ST’s strength in engine management was
confirmed by a design win for a reference platform from a major European
OEM for use in China and India, as well as in Europe. Additionally, ST
gained a key design win for an alternator controller IC for use in the new
Tata Nano car from India. ST also achieved a design win in energy-saving
and fuel-consumption optimization from a major European OEM. And in car
safety, ST’s automotive camera module prototype was delivered to European
car makers.
|
|
·
|
In
car body applications, ST’s smart-power products have continued to be
accepted by key players in Europe, North America and Korea with several
sockets being won in various applications. ST also gained a design win for
a dedicated ASIC from European and North American customers for emerging
applications using LED drivers.
|
|
·
|
In
automotive microcontrollers (MCUs), ST launched its new STM8 8-bit MCU
platform, aimed at automotive and multi-segment applications. Prototypes
of the first STM8 device have already been delivered to several tier-one
customers for use in a large variety of automotive applications. A further
milestone in the MCU area was achieved by the joint ST and Freescale
design program with the launch of four 32-bit Power Architecture™
MCUs.
|
|
·
|
In
general-purpose microcontrollers, in addition to the launch of the STM8
8-bit MCU platform, which will be ramping up in volume later this year for
multiple markets, ST’s leading-edge 32-bit STM32 Cortex-M3 based platform
gained further industry recognition with the winning of a best tools prize
at the 2008 Embedded Awards by Hitex’s STM32 PerformanceStick evaluation
kit.
|
|
·
|
In
MEMS applications, ST gained three significant design wins for its motion
sensing accelerometers for mobile consumer products. In addition, ST
announced that its three-axis acceleration sensors are being used to
enable motion control in the new Air Mouse and Music Remote from Gyration,
the consumer electronics brand from Movea, Inc.Gyration’s in-air
motion-control products use ST’s accelerometer technology to translate
natural hand movements into on-screen action, accurately responding to
changes in position and direction.
|
|
·
|
In
the fast emerging NFC (Near Field Communication) market, which provides
advanced wireless or ‘contactless’ services for users, such as electronic
payment via mobile phone, ST introduced a secure SoC solution, based on
the ST21 smart card MCU, that integrates all the necessary hardware and
software for a complete NFC system.
|
|
·
|
In
memory ICs, ST announced that it is the first to offer a complete serial
EEPROM portfolio from 2 Kbit to 128 Kbit in both I2C and SPI versions,
benefiting from space-saving MLP (Micro Leadframe Package)
technology.
|
|
·
|
For
power conversion markets, ST gained design wins for its smart-power
converters in products as different as induction cookers and audio
applications, together with backlight driver ICs for display panels. ST
also released details of a new flexible and cost-saving controller for
high-performance flyback power
converters.
|
|
·
|
In
power discretes, ST announced two new power MOSFETs that use ST’s
proprietary STripFET™ technology to deliver extremely low conduction and
switching losses, aimed at the most demanding DC-DC converter
applications. ST was also awarded a design win for a custom device for a
major automotive energy-saving program; and multiple wins for its MDmesh™
II technology in various segments. The Company also further strengthened
its hand in delivering world-class power components with various design
wins for power bipolar, power RF, and IGBTs for a myriad of applications
from medical to portable radios.
|
|
·
|
In
protection ICs, ST introduced a new series of high-temperature TRIACs that
can maintain full performance up to a temperature of 150 degrees C in
appliance motor-control applications. The Company earned an important
design win in this field, too. ST also introduced new ICs that combine EMI
filtering and ESD protection in a single ultra-compact package, enabling
system designers of mobile phones, among other applications,
to
|
|
·
|
In
linear and interface ICs, ST achieved numerous design wins in a range of
applications, including many from market leaders within their segment.
Additionally, ST announced a low-profile stereo headset amplifier IC,
optimized for feature-phone applications, that improves audio performance,
extends battery life and enables more responsive user controls compared to
existing solutions.
|
|
·
|
In
advanced analog, ST gained design wins for real-time clock (RTC) chips
with major companies in server and computer-peripheral applications, in
addition to starting a major project for a medical application. The
Company also introduced a new series of drop-in replacement precision
digital-output temperature sensors that are ideal for low-power
applications in a broad range of product areas. In advanced logic
products, ST gained two important design wins: the first for a 6-bit level
translator for a dual memory card with a leading mobile phone maker; and
the second for a 24-bit LED driver IC for an outdoor display-panel
application.
|
|
·
|
future developments of the
world semiconductor market, in particular the future demand for
semiconductor products in the key application markets and from key
customers served by our
products;
|
|
·
|
the results of actions by our
competitors, including new product offerings and our ability to react
thereto;
|
|
·
|
curtailments of purchases from
key customers or
pricing pressures which are highly variable and difficult to
predict;
|
|
·
|
the financial impact of
obsolete or excess inventories if actual demand differs from our
anticipations;
|
|
·
|
the impact of
intellectual-property claims by our competitors or other third parties,
and our ability to obtain required licenses on reasonable terms and
conditions;
|
|
·
|
the outcome of ongoing
litigation as well as any new litigation to which we may become a
defendant;
|
|
·
|
changes in the exchange rates
between the US dollar and the Euro, compared to an assumed effective
exchange rate of US $1.55 = €1.00 and between the U.S. dollar and the
currencies of the other major countries in which we have our operating
infrastructure;
|
|
·
|
our ability to manage
in an intensely
competitive and cyclical industry, where a high percentage of our costs
are fixed, incurred in currencies other than US dollars which is our
reporting currency and difficult to reduce in
the short term,
including our ability to adequately utilize and operate our manufacturing
facilities at sufficient levels to cover fixed operating
costs;
|
|
·
|
our ability to restructure in
accordance with our plans if unforeseen events require
adjustments or delays in
implementation;
|
|
·
|
our ability in an intensively
competitive environment to secure customer
acceptance and to achieve our pricing expectations for high-volume
supplies of new products in whose development we have been, or are
currently, investing;
|
|
·
|
the ability of our suppliers
to meet our demands for supplies and materials and to offer competitive
pricing;
|
|
·
|
significant differences in the
gross margins we achieve compared to expectations, based on changes in
revenue levels, product mix and pricing, capacity utilization, variations
in inventory valuation, excess or obsolete inventory, manufacturing
yields, changes in unit costs, impairments of long-lived assets (including
manufacturing, assembly/test and intangible assets), and the timing,
execution and associated costs for the announced transfer of
manufacturing from facilities designated for closure and associated costs,
including start-up costs;
|
|
·
|
changes in the economic,
social or political environment, including military conflict
and/or terrorist activities, as well as natural events such
as severe weather, health risks, epidemics or earthquakes in the countries
in which we, our
key customers and
our suppliers, operate;
|
|
·
|
changes in our overall tax
position as a result of changes in tax laws or the outcome of tax audits,
and our ability to accurately estimate tax credits, benefits, deductions
and provisions and to realize deferred tax assets.
|
STMicroelectronics
N.V.
|
||||
Consolidated
Statements of Income
|
||||
(in
million of U.S. dollars, except per share data ($))
|
||||
Three
Months Ended
|
||||
(Unaudited)
|
(Unaudited)
|
|||
March
30,
|
March
31,
|
|||
2008
|
2007
|
|||
Net
sales
|
2,461
|
2,269
|
||
Other
revenues
|
17
|
7
|
||
NET
REVENUES
|
2,478
|
2,276
|
||
Cost
of sales
|
-1,579
|
-1,491
|
||
GROSS
PROFIT
|
899
|
785
|
||
Selling,
general and administrative
|
-304
|
-261
|
||
Research
and development
|
-509
|
-435
|
||
Other
income and expenses, net
|
9
|
-15
|
||
Impairment,
restructuring charges and other related closure costs
|
-183
|
-12
|
||
Total
Operating Expenses
|
-987
|
-723
|
||
OPERATING
INCOME (LOSS)
|
-88
|
62
|
||
Other-than-temporary
impairment charge on financial assets
|
-29
|
0
|
||
Interest
income, net
|
20
|
17
|
||
Earnings
(loss) on equity investments
|
0
|
7
|
||
INCOME
(LOSS) BEFORE INCOME TAXES
|
-97
|
86
|
||
AND
MINORITY INTERESTS
|
||||
Income
tax benefit (expense)
|
14
|
-11
|
||
INCOME
(LOSS) BEFORE MINORITY INTERESTS
|
-83
|
75
|
||
Minority
interests
|
-1
|
-1
|
||
NET
INCOME (LOSS)
|
-84
|
74
|
||
EARNINGS
(LOSS) PER SHARE (BASIC)
|
-0.09
|
0.08
|
||
EARNINGS
(LOSS) PER SHARE (DILUTED)
|
-0.09
|
0.08
|
||
NUMBER
OF WEIGHTED AVERAGE
|
||||
SHARES
USED IN CALCULATING
|
899.8
|
900.4
|
||
DILUTED
EARNINGS (LOSS) PER SHARE
|
||||
STMicroelectronics
N.V.
|
|||||||||
CONSOLIDATED
STATEMENTS OF CASH FLOWS
|
|||||||||
Three
Months
Ended
|
Three
Months
Ended
|
Three
Months
Ended
|
|||||||
March
30,
|
December
31,
|
March
31,
|
|||||||
In
million of U.S. dollars
|
2008
|
2007
|
2007
|
||||||
(Unaudited)
|
(Unaudited)
|
(Unaudited)
|
|||||||
Cash
flows from operating activities:
|
|||||||||
Net
income (loss)
|
-84
|
20
|
74
|
||||||
Items
to reconcile net income (loss) and cash flows from operating
activities
|
|||||||||
Depreciation
and amortization
|
341
|
334
|
398
|
||||||
Amortization
of discount on convertible debt
|
4
|
5
|
4
|
||||||
Other-than-temporary
impairment charge on financial assets
|
29
|
46
|
0
|
||||||
Other
non-cash items
|
21
|
31
|
22
|
||||||
Minority
interests
|
1
|
1
|
1
|
||||||
Deferred
income tax
|
29
|
-135
|
-7
|
||||||
(Earnings)
loss on equity investments
|
0
|
-2
|
-7
|
||||||
Impairment,
restructuring charges and other related closure costs, net of cash
payments
|
167
|
268
|
-7
|
||||||
Changes
in assets and liabilities:
|
|||||||||
Trade
receivables, net
|
96
|
38
|
100
|
||||||
Inventories,
net
|
-142
|
15
|
-30
|
||||||
Trade
payables
|
86
|
64
|
-34
|
||||||
Other
assets and liabilities, net
|
-46
|
52
|
-38
|
||||||
Net
cash from operating activities
|
502
|
737
|
476
|
||||||
Cash
flows from investing activities:
|
|||||||||
Payment
for purchases of tangible assets
|
-258
|
-405
|
-285
|
||||||
Payment
for purchases of marketable securities
|
0
|
0
|
-445
|
||||||
Proceeds
from sale of marketable securities
|
0
|
1
|
0
|
||||||
Proceeds
from matured short-term deposits
|
0
|
0
|
250
|
||||||
Restricted
cash
|
0
|
0
|
-32
|
||||||
Investment
in intangible and financial assets
|
-25
|
-144
|
-19
|
||||||
Payment
for business acquisitions, net of cash and cash equivalents
acquired
|
-170
|
0
|
0
|
||||||
Net
cash used in investing activities
|
-453
|
-548
|
-531
|
||||||
Cash
flows from financing activities:
|
|||||||||
Proceeds
from issuance of long-term debt
|
136
|
20
|
1
|
||||||
Repayment
of long-term debt
|
-7
|
-13
|
-34
|
||||||
Capital
increase
|
0
|
0
|
1
|
||||||
Net
cash from (used in) financing activities
|
129
|
7
|
-32
|
||||||
Effect
of changes in exchange rates
|
27
|
9
|
-1
|
||||||
Net
cash increase (decrease)
|
205
|
205
|
-88
|
||||||
Cash
and cash equivalents at beginning of the period
|
1,855
|
1,650
|
1,659
|
||||||
Cash
and cash equivalents at end of the period
|
2,060
|
1,855
|
1,571
|
||||||
STMicroelectronics
N.V.
|
|||||||
CONSOLIDATED
BALANCE SHEETS
|
|||||||
As
at
|
March
30,
|
December
31,
|
March
31,
|
||||
In
million of U.S. dollars
|
2008
|
2007
|
2007
|
||||
(Unaudited)
|
(Audited)
|
(Unaudited)
|
|||||
ASSETS
|
|||||||
Current
assets:
|
|||||||
Cash
and cash equivalents
|
2,060
|
1,855
|
1,571
|
||||
Marketable
securities
|
1,060
|
1,014
|
1,209
|
||||
Trade
accounts receivable, net
|
1,546
|
1,605
|
1,492
|
||||
Inventories,
net
|
1,539
|
1,354
|
1,676
|
||||
Deferred
tax assets
|
230
|
205
|
193
|
||||
Assets
held for sale
|
0
|
1,017
|
0
|
||||
Other
receivables and assets
|
626
|
612
|
533
|
||||
Total
current assets
|
7,061
|
7,662
|
6,674
|
||||
Goodwill
|
314
|
290
|
224
|
||||
Other
intangible assets, net
|
317
|
238
|
208
|
||||
Property,
plant and equipment, net
|
5,391
|
5,044
|
6,295
|
||||
Long-term
deferred tax assets
|
270
|
237
|
130
|
||||
Equity
investments
|
1,035
|
0
|
274
|
||||
Restricted
cash
|
250
|
250
|
250
|
||||
Non-current
marketable securities
|
339
|
369
|
0
|
||||
Other
investments and other non-current assets
|
357
|
182
|
145
|
||||
8,273
|
6,610
|
7,526
|
|||||
Total
assets
|
15,334
|
14,272
|
14,200
|
||||
LIABILITIES
AND SHAREHOLDERS' EQUITY
|
|||||||
Current
liabilities:
|
|||||||
Current
portion of long-term debt
|
300
|
103
|
103
|
||||
Trade
accounts payable
|
1,114
|
1,065
|
957
|
||||
Other
payables and accrued liabilities
|
912
|
744
|
641
|
||||
Deferred
tax liabilities
|
13
|
11
|
6
|
||||
Accrued
income tax
|
139
|
154
|
56
|
||||
Total
current liabilities
|
2,478
|
2,077
|
1,763
|
||||
Long-term
debt
|
2,324
|
2,117
|
2,010
|
||||
Reserve
for pension and termination indemnities
|
302
|
323
|
348
|
||||
Long-term
deferred tax liabilities
|
32
|
14
|
61
|
||||
Other
non-current liabilities
|
306
|
115
|
103
|
||||
2,964
|
2,569
|
2,522
|
|||||
Total
liabilities
|
5,442
|
4,646
|
4,285
|
||||
Commitment
and contingencies
|
|||||||
Minority
interests
|
54
|
53
|
53
|
||||
Common
stock (preferred stock:
540,000,000 shares authorized, not issued;
|
1,156
|
1,156
|
1,156
|
||||
common
stock: Euro 1.04 nominal value, 1,200,000,000 shares authorized,
910,298,305 shares
|
|||||||
issued,
899,771,765 shares outstanding)
|
|||||||
Capital
surplus
|
2,131
|
2,097
|
2,040
|
||||
Accumulated
result
|
5,190
|
5,274
|
6,160
|
||||
Accumulated
other comprehensive income
|
1,635
|
1,320
|
838
|
||||
Treasury
stock
|
-274
|
-274
|
-332
|
||||
Shareholders'
equity
|
9,838
|
9,573
|
9,862
|
||||
Total
liabilities and shareholders' equity
|
15,334
|
14,272
|
14,200
|
||||
STMicroelectronics
N.V.
|
||||
Date: April
29, 2008
|
By:
|
/s/
Carlo
Ferro
|
||
Name:
|
Carlo
Ferro
|
|||
Title:
|
Executive
Vice President and
|
|||
Chief
Financial Officer
|