“Having recently attended the Jazz Annual Technology Conference, the information presented was valuable in understanding the full spectrum of process offerings and design enablement capabilities that Jazz and Tower now can offer their customers post-merger,” said Len Jelinek, Director and Chief Analyst, Semiconductor Manufacturing Services, iSuppli Corporation.

In addition to the strategic overview, the global conference series will include presentations from Jazz focusing on market needs and technology solutions for RF/mmWave and High Performance Analog (HPA), SiGe BiCMOS, Power Management (LDMOS) and MEMS, as well as presentations from Tower on CMOS Image Sensors (CIS), IDM Process Transfer capabilities and Embedded Non-Volatile Memory (eNVM). A detailed technical update of the companies’ world class Design Enablement Technology including design kits, modeling and design tools offered by Jazz and Tower will also be presented.

“This series of technology conferences is designed to provide our customers and prospective customers all over the world with an opportunity to hear firsthand how the merger of Jazz and Tower meets their growing needs for the development of advanced analog-intensive mixed-signal (AIMS) ICs,” said Chuck Fox, senior vice president of worldwide sales, Tower Semiconductor. “By offering presentations on several key commercial processes and market offerings, attendees will become familiar with our key differentiators and the breadth of solutions we provide as a leading global specialty foundry.”

For more information on the San Jose and London conferences and to find out upcoming dates for other cities, please visit the news and events sections at www.jazzsemi.com or www.towersemi.com.

About Tower Semiconductor, Ltd. and Jazz Semiconductor, Inc.
Tower Semiconductor Ltd. (NASDAQ: TSEM, TASE: TSEM) is a pure-play independent specialty wafer foundry and Jazz Semiconductor, Inc., a Tower Group Company, is a leader in Analog-Intensive Mixed-Signal (AIMS) foundry solutions. Tower and Jazz manufacture integrated circuits with geometries ranging from 1.0 to 0.13-micron and provide complementary technical services and design support. In addition to digital CMOS process technology, Tower offers advanced mixed-signal and RF CMOS, Power Management, CMOS image-sensor, non-volatile memory technologies and Flash MTP and OTP solutions.  Jazz’s comprehensive process portfolio of modular AIMS technologies includes RFCMOS, Analog CMOS, Silicon and SiGe BiCMOS, SiGe C-BiCMOS, Power CMOS and High Voltage CMOS. To provide world-class customer service, Tower maintains two manufacturing facilities in Israel; Jazz maintains a fab in the U.S. and additional capacity in China through manufacturing alliances with ASMC and HHNEC. For more information, please visit www.towersemi.com and www.jazzsemi.com.